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Writing about AI — how it works, where it helps, and what we learn building with it.
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Maia 300 Buys 36% More Compute and 2.5x the Memory Bandwidth. The Ratio Is the ArgumentMicrosoft's third custom AI accelerator, unveiled at the OCP Global Summit, adds 36% more compute and 2.5 times the memory bandwidth of Maia 200 — a deliberate bet that inference is memory-bound, not compute-bound. It will not be sold to Azure customers, which tells you what it is for.Engineering
A 2.78-Trillion-Parameter Model Now Runs in 8 GB of RAM and 179 KB of C. The Number That Matters Is 1.7 Terabyteskimi-k3-in-c fits Moonshot's largest open-weight model onto an ordinary machine by exploiting how little of a mixture-of-experts model is actually live at once. The engineering is real and the arithmetic checks out — but the headline hides where the hardware requirement actually went.Engineering
Anthropic's Modernization Plugin Will Rewrite Your COBOL. First It Makes You Prove You Understand ItThe code-modernization plugin for Claude Code turns legacy migration into an enforced sequence — discovery, then a human approval gate, then code. Most of its design is spent refusing to skip steps, and the refusals are the interesting part.Engineering
China Reached the Industry's Leading DRAM Node Without EUV. It Took Four Exposures Where Rivals Use OneCXMT announced on Sunday that its fifth-generation DRAM platform has entered mass production at an 11.95-nanometer array half-pitch, matching the geometry of the most advanced nodes now shipping. It got there with deep-ultraviolet quadruple patterning, because EUV scanners cannot be sold into China — and that substitution is the whole story.Engineering
Huawei Moved Its Next AI Chip Up Nine Months. The Part Worth Reading Twice Was About LightAt Huawei Connect 2026 the company pulled the Ascend 960DT forward to Q1 2027, but the accelerator date is a supply signal, not a silicon one. The real announcement was Hi-ONE, a near-packaged-optics interconnect Huawei says is the first ready for volume manufacture.Engineering